<?xml version="1.0" encoding="utf-8"?> <feed xmlns:dc="http://dublincore.org/documents/dcmi-namespace/" xmlns:media="http://search.yahoo.com/mrss/" xmlns="http://www.w3.org/2005/Atom"> <title type="text">Overbond, Ltd.</title> <subtitle type="text">Contains the last 20 releases</subtitle> <id>uuid:3ec27fbb-2602-4643-94e1-c92d21150e7f;id=2189</id> <rights type="text">Copyright 2017, Overbond, Ltd.</rights> <updated>2017-09-12T12:00:00Z</updated> <author> <name>newsdesk@globenewswire.com (NewsDesk)</name> <uri>http://www.globenewswire.com/LegacyRss?Length=4</uri> <email>newsdesk@globenewswire.com</email> </author> <link rel="alternate" href="https://www.globenewswire.com/atomfeed/organization/Nokhwd8azDIoVvuF0jXTcQ==" /> <link rel="self" href="https://www.globenewswire.com/atomfeed/organization/Nokhwd8azDIoVvuF0jXTcQ==" /> <entry> <id>https://www.globenewswire.com/news-release/2017/09/12/1171235/0/en/Overbond-Expands-Primary-Bond-Market-Deal-Capabilities-with-Corporate-Bond-Intelligence-and-OpenFin-Integration.html</id> <title type="text">Overbond Expands Primary Bond Market Deal Capabilities with Corporate Bond Intelligence and OpenFin Integration</title> <published>2017-09-12T12:00:00Z</published> <updated>2024-11-09T01:14:49Z</updated> <link rel="alternate" href="https://www.globenewswire.com/news-release/2017/09/12/1171235/0/en/Overbond-Expands-Primary-Bond-Market-Deal-Capabilities-with-Corporate-Bond-Intelligence-and-OpenFin-Integration.html" /> <content type="html"><![CDATA[<p><em><p>New product breakthrough applies machine learning and predictive analytics to match investors with real-time credit investment opportunities</p></em></p><p><span class="mw_region">TORONTO, ON and NEW YORK, NY</span><span>--(Marketwired - September 12, 2017) - </span><a href="https://www.overbond.com" rel="nofollow" title="Overbond">Overbond</a>, the first end-to-end capital markets fintech platform for primary bond origination, has launched COBI Opportunities, a new proprietary issuer-investor matching solution for primary bond markets.</p>]]></content> <dc:identifier>1171235</dc:identifier> <dc:language>en</dc:language> <dc:publisher>GlobeNewswire Inc.</dc:publisher> <dc:contributor>Overbond, Ltd.</dc:contributor> <dc:modified>Wed, 01 Nov 2017 01:31 GMT</dc:modified> </entry> <entry> <id>https://www.globenewswire.com/news-release/2016/12/14/1117134/0/en/DBRS-Credit-Ratings-Integrated-with-Overbond-Platform.html</id> <title type="text">DBRS Credit Ratings Integrated with Overbond Platform</title> <published>2016-12-14T13:00:00Z</published> <updated>2024-11-09T01:14:49Z</updated> <link rel="alternate" href="https://www.globenewswire.com/news-release/2016/12/14/1117134/0/en/DBRS-Credit-Ratings-Integrated-with-Overbond-Platform.html" /> <content type="html"><![CDATA[<p><em><p>Primary Bond market investors, issuers, and dealers will be able to access and analyze DBRS ratings data and links to issuer-level research reports directly from Overbond platform. </p></em></p><p><span class="mw_region">TORONTO, ON and NEW YORK, NY</span><span>--(Marketwired - December 14, 2016) - </span><strong> </strong>DBRS, a global provider of credit ratings, and Overbond, the first fully-digital platform for primary bond issuance, announced today an arrangement to provide participants in the primary bond origination market with access to DBRS ratings data and proprietary DBRS research reports, integrated into the Overbond platform.</p>]]></content> <dc:identifier>1117134</dc:identifier> <dc:language>en</dc:language> <dc:publisher>GlobeNewswire Inc.</dc:publisher> <dc:contributor>DBRS;Overbond, Ltd.</dc:contributor> <dc:modified>Wed, 01 Nov 2017 01:31 GMT</dc:modified> <dc:keyword>fintech</dc:keyword> <dc:keyword>financial technology</dc:keyword> <dc:keyword>capital markets</dc:keyword> <dc:keyword>bonds</dc:keyword> <dc:keyword>bond issuance</dc:keyword> <dc:keyword>primary bond market</dc:keyword> <dc:keyword>finance</dc:keyword> </entry> <entry> <id>https://www.globenewswire.com/news-release/2016/11/03/1117133/0/en/Overbond-Integrates-Thomson-Reuters-Fixed-Income-Market-Data-with-Overbond-Platform.html</id> <title type="text">Overbond Integrates Thomson Reuters Fixed-Income Market Data with Overbond Platform</title> <published>2016-11-03T11:30:00Z</published> <updated>2024-11-09T01:14:49Z</updated> <link rel="alternate" href="https://www.globenewswire.com/news-release/2016/11/03/1117133/0/en/Overbond-Integrates-Thomson-Reuters-Fixed-Income-Market-Data-with-Overbond-Platform.html" /> <content type="html"><![CDATA[<p><em><p>Access to Thomson Reuters fixed income market data and market analytics within the Overbond platform optimizes price discovery for participants in the primary bond origination market</p></em></p><p><span class="mw_region">TORONTO, ON and NEW YORK, NY</span><span>--(Marketwired - November 03, 2016) - </span> <a href="https://www.overbond.com/" rel="nofollow" title="Overbond Ltd.">Overbond Ltd.</a>, the first fintech platform in the new bond issuance market, today announced a partnership with <a href="http://thomsonreuters.com/en.html" rel="nofollow" title="Thomson Reuters">Thomson Reuters</a> that will see fixed income market data and analytics integrated within the Overbond platform. Through Thomson Reuters Labs, the companies will also be exploring opportunities to drive further innovation in the fixed income capital markets through collaborative research and development. </p>]]></content> <dc:identifier>1117133</dc:identifier> <dc:language>en</dc:language> <dc:publisher>GlobeNewswire Inc.</dc:publisher> <dc:contributor>Overbond, Ltd.</dc:contributor> <dc:modified>Wed, 01 Nov 2017 01:31 GMT</dc:modified> </entry> <entry> <id>https://www.globenewswire.com/news-release/2016/06/29/1117132/0/en/Overbond-Launches-the-First-End-to-End-Platform-for-Primary-Bond-Origination.html</id> <title type="text">Overbond Launches the First End-to-End Platform for Primary Bond Origination</title> <published>2016-06-29T12:00:00Z</published> <updated>2024-11-09T01:14:49Z</updated> <link rel="alternate" href="https://www.globenewswire.com/news-release/2016/06/29/1117132/0/en/Overbond-Launches-the-First-End-to-End-Platform-for-Primary-Bond-Origination.html" /> <content type="html"><![CDATA[<p align="center" style="text-align:left"><span class="mw_region">TORONTO, ON</span><span>--(Marketwired - June 29, 2016) - </span><a href="https://www.overbond.com" rel="nofollow" title="Overbond">Overbond</a> Ltd., the first fintech entrant into the new bond issuance market, has launched an end-to-end platform and support framework for primary bond origination. The fully-digital Overbond platform for primary bond issuance provides higher transparency, better price discovery, and investor diversification for all counterparties in the primary bond market. It is the first fully-integrated platform to connect bond market issuers, dealers, and fixed-income investors.</p>]]></content> <dc:identifier>1117132</dc:identifier> <dc:language>en</dc:language> <dc:publisher>GlobeNewswire Inc.</dc:publisher> <dc:contributor>Overbond, Ltd.</dc:contributor> <dc:modified>Wed, 01 Nov 2017 01:31 GMT</dc:modified> <dc:keyword>Overbond</dc:keyword> <dc:keyword>fintech</dc:keyword> <dc:keyword>primary bond market</dc:keyword> <dc:keyword>primary bond origination</dc:keyword> <dc:keyword>primary bond issuance</dc:keyword> <dc:keyword>digital bond platform</dc:keyword> <dc:keyword>bond market</dc:keyword> <dc:keyword>Overbond BPS</dc:keyword> <dc:keyword>Overbond platform</dc:keyword> </entry> <entry> <id>https://www.globenewswire.com/news-release/2016/06/16/1117131/0/en/Overbond-Secures-7-5M-in-Seed-Financing.html</id> <title type="text">Overbond Secures $7.5M in Seed Financing</title> <published>2016-06-16T11:00:00Z</published> <updated>2024-11-09T01:14:49Z</updated> <link rel="alternate" href="https://www.globenewswire.com/news-release/2016/06/16/1117131/0/en/Overbond-Secures-7-5M-in-Seed-Financing.html" /> <content type="html"><![CDATA[<p><em><p>Injection of Capital Positions Overbond to Transform Investment Banking and Bond Issuance Market</p></em></p><p><span class="mw_region">TORONTO, ON </span><span>--(Marketwired - June 16, 2016) - </span><a href="https://www.overbond.com/" rel="nofollow" title="Overbond">Overbond</a> Ltd., the first fintech platform for digital bond issuance, has closed a $7.5-million seed financing round with <a href="http://morrisonfinancial.com/" rel="nofollow" title="Morrison Financial Services Limited">Morrison Financial Services Limited</a>. The deal marks a significant step forward for the company as the first fintech entrant into the new bond issuance market. Overbond plans to use the financing to expand its fully-digital primary bond issuance platform. </p>]]></content> <dc:identifier>1117131</dc:identifier> <dc:language>en</dc:language> <dc:publisher>GlobeNewswire Inc.</dc:publisher> <dc:contributor>Overbond, Ltd.</dc:contributor> <dc:modified>Wed, 01 Nov 2017 01:31 GMT</dc:modified> <dc:keyword>overbond</dc:keyword> <dc:keyword>investment banking</dc:keyword> <dc:keyword>bond market</dc:keyword> <dc:keyword>bond issuance</dc:keyword> <dc:keyword>fintech</dc:keyword> <dc:keyword>primary bond market</dc:keyword> <dc:keyword>digital bond issuance</dc:keyword> <dc:keyword>institutional capital markets</dc:keyword> <dc:keyword>Overbond BPS</dc:keyword> <dc:keyword>bond origination</dc:keyword> </entry> </feed>